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  *Fully-automatic system for the outer lead
  *Vision alignment
  *Available for small-diameter balls

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  *Fully-automatic system for the outer lead
  *Vision alignment and inspection features equipped

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  *For BGA/CSP
  *Vision alignment and inspection features equipped

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  *Fully-automatic system for inner lead
  *Min.Φ 60µm balls
  *Ball mounting section only

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  *Fully-automatic system
  *Vision alignment
  *Max. 45 wafers / hr.

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  *Fully-automatic system for 12 inch wafer and micro balls

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  *Semi-automatic system for 12 inch wafer

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  *Ball mounting system for experiment and small lot production applications
  *No tools needed for attachment changes

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  *Ball mounting system for research and repairing
  *No conversion kit is required

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  *Fully-automatic post-inspection and repair system for 12 inch wafer and micro balls

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  *For process R&D/small lot production
  *Best selling machine for R&D use
  *± 2µm accuracy

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  *High precision/High speed machine for mass production
  *± 2µm accuracy
  *Machine speed 1.6 sec.

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  *For C4 mass production
  *Stable force

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  *For Chip LED mass production
  *Available for small parts

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  *High precision 3D bonding machine for mass production
  *± 2.5µm accuracy
  *Also available for large substrate and embedded bonding

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  *High precision machine for photonic chip
  *± 1µm accuracy

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  *Mass production machine for stacked package
  *Filming DAF on a substrate with few void chips and high adhesive process
  *No curing oven is required

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  *FDA filming machine
  *Filming DAF on a substrate with few void chips and high adhesive process

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  *Chip pressing machine
  *No curing oven
  *Few void chips and high adhesive process

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  *Glass chip mounting on image sensors for mass production applications
  *Cleanness class 100 or less environment
  *For chip-on-wafer

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  *Glass chip mounting on image sensors for mass production application line
  *Cleanness class 100 or less environment
  *Resin application with dual head

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  *High throughput(UPH 24,000)
  *Disc type index

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  *High throughput(UPH 24,000)
  *Good track record for BLU LED

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  *For illumination LED module

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  *High throughput(UPH 30,000)
  *Unique sorting mechanism utilizing disc type index

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  *High throughput(UPH 51,000)
  *Automatic Replacement function for defective workpieces

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  New microfabrication technology combined with laser and water jet techniques

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For further information, please contact;

SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp