- *Fully-automatic system for the outer lead
*Vision alignment
*Available for small-diameter balls
- *Fully-automatic system for the outer lead
*Vision alignment and inspection features equipped
- *For BGA/CSP
*Vision alignment and inspection features equipped
- *Fully-automatic system for inner lead
*Min.Φ 60µm balls
*Ball mounting section only
- *Fully-automatic system
*Vision alignment
*Max. 45 wafers / hr.
- *Fully-automatic system for 12 inch wafer and micro balls
- *For process R&D/small lot production
*Best selling machine for R&D use
*± 2µm accuracy
- *High precision/High speed machine for mass production
*± 2µm accuracy
*Machine speed 1.6 sec.
- *For C4 mass production
*Stable force
- *For Chip LED mass production
*Available for small parts
- *High precision 3D bonding machine for mass production
*± 2.5µm accuracy
*Also available for large substrate and embedded bonding
- *High precision machine for photonic chip
*± 1µm accuracy
- *Mass production machine for stacked package
*Filming DAF on a substrate with few void chips and high adhesive process
*No curing oven is required
- *FDA filming machine
*Filming DAF on a substrate with few void chips and high adhesive process
- *Chip pressing machine
*No curing oven
*Few void chips and high adhesive process
- *256 classifications (op. 128, 512 classifications)
*High speed processing
- *Wafer supply
*Tray storage
*Handling wide variety of products
- *128 bulk bins
*Ambient temperature-high temperature-ambient temperature measurement
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp