Model DB250
High precision flip chip bonding machine for various experiences, R & D and small lot production applications.
Plenty of options such as multi-step force and position control during bonding and 4-step heating control provide best development results depending on purposes.
- Easy setting by parameter input for bonding conditions such as bonding head height, compression force, temperature, timing, etc
- High speed heating and cooling
- High accuracy ball bonding by vision system alignment
- Easy teaching from the simultaneous observation of chips and a substrate (Optional)
- Automatic calibration offers stable precision
- No tools needed for attachment changes
- Many options for various techniques
- Paste transfer
- Ultrasonic bonding unit
- Dispenser
- N2 hot purge
- Scrub software
- Microchip (less than 1 x 1mm)
- Laser bonding head
| Model | DB250 |
|---|---|
| Substrate size | Max. 180 x 180 mm |
| Substrate material | Si, PCB, glass, ceramic, polyimide etc. |
| Chip size | 1 x 1 ~ 20 x 20 mm |
| Chip supply method | Tray (2 inch / 4 inch) |
| Chip heating system | Pulse heat |
| Substrate heating system | Constant heat |
| Bonding force | Low force spec.: Max. 49N , High force spec.: Max. 490N |
| Bonding accuracy | ± 2µm (reference value) |
| Dimensions | 1000(L) x 1100(W) x 1845(H) mm |
| Net weight | 1100kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp