Model DBM200P
Flip chip bonding machine which enables high speed and high presicion (± 1µm) alingment.
- High precision flip chip bonder for photonic device
- Small size chips from 0.25 x 0.25 mm can be used
- Compact space saving design
- Automatic calibration offers stable precision
- Chip angled mounting
- Easy setting by parameter input for bonding conditions such as bonding head height, compression force, temperature, timing, etc
- Automatic tool changer
- For 3 chips (Standard: 2 chips)
- Substrate and chip edge face recognition function
- Centroid detection
- N2 hot purge
- Chip angled mounting
- Vacuum pump
| Model | DBM200P |
|---|---|
| Substrate size | Max. 20 x 20 mm |
| Chip size | 0.25 x 0.25 ~ 5.0 x 5.0 mm |
| Bonding force | 50 ~ 3000mmN |
| Chip heating | Max. 450°C |
| Bonding accuracy | X: ± 1µm, Y: ± 1µm, Θ: ± 0.5° |
| Cycle time | 60 sec. / chip |
| Dimensions | 1000(L) x 1000(W) x 1770(H) mm |
| Net weight | 950kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp