Model DFM200
System which films singulated DFA on a substrate. Achieved few void chips and high adhesiveness by the press mechanism.
- Improves cost efficiency by adopting pre-filming method
- Excellent at stacking chips
- Achieved few void, high adhesion by adopting film pressing method
| Model | DFM200 |
|---|---|
| Film size | 0.2 x 0.2 ~ 25.0 x 25.0 mm |
| Substrate size | Max. 300(L) x 200(W) mm |
| Bonding force | Max. 3N |
| Filming accuracy | ± 50µm(3σ) |
| Cycle time | 1.2 sec. / film |
| Dimensions | 1780(L)x900(W)x1600(H)mm |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp