Model FDB200
High speed and high precision flip chip bonding machine for mass production applications.
Various bonding methods such as NCP and ACF, Au-solder, and solder-solder can be used.
Ultrasonic bonding can be also used as an optional function. Suitable for SIP and MCM productions as 4 kinds of chips can be mounted automatically.
- ± 2µm high precision bonding
- 1.6 seconds cycle time
- Respond to various bonding techniques
- Up to 4 mixed kinds of multi chips and various types of processes can be used
| Model | FDB200 |
|---|---|
| Substrate size | Max. 200 (L) x 150 (W) mm |
| Chip size | 0.3 x 0.3 ~ 20.0 x 20.0 mm |
| Chip supply method | Tray (2 inch / 4 inch), wafer (Max. 12 inch) |
| Bonding force | 0.3 ~ 30N / 5 ~ 343N |
| Bonding accuracy | ± 2µm (3σ) (reference value) |
| Cycle time | 1.6 sec. / chip |
| Dimensions | 1440(L) x 1150(W) x 1600(H) mm |
| Net weight | 1800kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp