Model FDB250
Flip chip bonding machine for C4 technique. Places chips from a wafer and bonds with stable force.
- Flip chip bonder for C4 high volume production applications
- Supplies chips on a wafer
- Automatic calibration offers stable precision
- Our unique bonding heads offer stable force
- Chip angled mounting
- Easy setting by parameter input for bonding conditions such as bonding head height, compression force, temperature, timing, etc
| Model | FDB250 |
|---|---|
| Wafer size | Φ 8, 12 inch |
| Substrate size | Max. 250 (L) x 70 (W) mm |
| Chip size | 1 x 1 ~ 20 x 20 mm |
| Bonding force | 1~9N |
| Bonding accuracy | ± 15µm (3σ) |
| Cycle time | 3.6 sec. / chip (Flux transfer and processing time are included.) |
| Alignment method | 2 camera vision system (Grey scale/sub pixel image) |
| Dimensions | 1550(L) x 1700(W) x 2130(H) mm |
| Net weight | 1700kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp