Model FDB280

• Flip chip bonder for C4, thermocompression bonding, high volume production applications
• Small size chips from 0.3 x 0.3 mm can be used
• Automatic calibration offers stable precision
• Chip angled mounting
• Easy setting by parameter input for bonding conditions such as bonding head height, compression force, temperature, timing, etc

Model	FDB280
Wafer size	Φ 2, Φ 3 inch
Substrate size	Max. 200 (L) x 100 (W) mm
Chip size	0.3 x 0.3 ~ 1 x 1 mm
Cycle time	2.5 sec. / chip (reference value)
Bonding force	0.49 ~ 5N
Bonding accuracy	± 5µm (3σ)
Dimensions	1320(L) x 1000(W) x 1600(H) mm
Net weight	1300kg