Model FUB250
Die bonding machine which bonds chips after filming DAF on a substrate with few void chips and high adhesive process, and performs the chip press process without going through a curing oven. Available for stacked package.
- Suitable for thin chips
- For 300 mm wafer
- Improves cost efficiency by adopting pre-filming method
- Excellent at stacking chips
- Achieved few void, high adhesion by adopting film pressing method
- Chip press method requires NO curing oven
- Delicate handling of thin chips
- Dispense unit can be equipped
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp