Model FUB300
High precision bonding machine which mounts glass chips directly on image sensors of a wafer before dicing.
- ± 10µm high precision
- For cleanness class 100 or less environment
| Model | FUB300 |
|---|---|
| Wafer size | 6, 8 inch (option: 12 inch) |
| Glass supply method | Tray (2 inch / 4 inch), also available for specialized tray |
| Bonding force | 1~30N |
| Heating | Max. 450°C |
| Bonding accuracy | ± 10µm |
| Cycle time | 3.0 sec. / chip |
| Dimensions | 2300(L) x 1900(W) x 1910(H) mm |
| Net weight | 1400kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp