Model FUB350
High precision die bonding machine which picks up IC chips from a wafer, visually aligns the chips after the appearance inspection at the middle stage, and bonds on another wafer.
- High precision bonder for 3D bonding (chip-on-chip)
- 50µm thickness of wafer can be used
- IC chip appearance inspection mechanism equipped
- IC chip position accuracy measurement mechanism equipped
- Easy setting by parameter input for bonding conditions such as bonding head height, compression force, temperature, timing, etc
| Model | FUB350 |
|---|---|
| Wafer size | Φ 6, Φ 8 inch |
| Chip size | 2 x 2 ~ 6 x 6 mm |
| Bonding force | 0.2 ~ 5N |
| Chip heating | Max. 450°C |
| Bonding accuracy | ± 2.5µm (3σ) |
| Cycle time | 3 sec. / chip |
| Dimensions | 1330(L) x 2200(W) x 2000(H) mm |
| Net weight | 1400kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp