Model SBM101
Space-saving solder ball mounting machine which mounts balls on a manually provided BGA substrate. Suitable from prototypes to mass production applications.
- Suitable for trail product, research and development and small lot production
- No transfer trays or attachment jigs
- Flexible pin transfer along the substrate warping
- No tools needed for attachment changes
| Model | SBM101 |
|---|---|
| Solder ball size | Φ 0.3 ~ 1.0 mm |
| 1 ball mounting area | Max. 50 x50 mm/mount |
| Substrate size | Max. 100(W) x 230(L) mm |
| Cycle time | 15 sec. / mount |
| Ball mounting accuracy | ± 0.1 mm |
| Dimensions | 1000(L) x 810(W) x 1700(H) mm |
| Net weight | 500kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp