Model SBM280
Solder ball mounting machine which mounts balls one by one on a wafer and substrate by programming its alignment pattern. Also suitable for experiment and prototypes.
- The programmable single ball mounting position and alignment provide mounting flexibility
- Fine pitch application
- Can be used for repairing missing ball mounting areas
| Model | SBM280 |
|---|---|
| Solder ball size | Φ 0.2 ~ 1.0 mm |
| Ball mounting area | Max. Φ 8 inch |
| Cycle time | 0.8 sec. / ball |
| Ball mounting accuracy | ± 0.025mm (3σ) |
| Dimensions | 1060(L) x 800(W) x 1680(H) mm |
| Net weight | 350kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp