Model SBM351
Highly productive solder ball mounting machine which enables automatic vision alignment, all-at-once flux transfer and ball mounting for mass production applications on a BGA substrate. The vision system inspection is included as a standard feature.
- Vision system inspection is a standard feature
- High accuracy ball mounting by vision system alignment
- Suitable for mass production applications
- Flexible pin transfer along the substrate warping
- Also suitable for screen printing of flux and solder paste
- Floating ball supply system with suction ball pick-up prevents ball damages
- Ball suction error detection is a standard feature
| Model | SBM351 |
|---|---|
| Solder ball size | Φ 0.2~1.0mm |
| Ball mounting area | Max. 230(L) x 70(W) mm |
| BGA substrate size | Max. 270(L) x 110(W) mm |
| Cycle time | Min. 9 sec. / substrate |
| Ball mounting accuracy | ± 0.05mm(3σ) |
| Dimensions | 1345(L)x2150(W)x1750(H)mm |
| Net weight | 1900kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp