Model SBM362
Fully-automated high speed solder ball mounting machine which enables all-at-once ball mounting for mass production applications on a wafer. Enables stable production by 100% inspection after mounting.
- All-at-once wafer mounting for mass production applications
- High accuracy ball mounting by vision system alignment
- 100% inspection after mounting
- Floating ball supply system with suction ball pick-up prevents ball damages
- Force detections during ball mounting allow stable mounting
- High productivity provided by fully-automatic operation
| Model | SBM362 |
|---|---|
| Solder ball size | Φ 0.2 ~ 0.5 mm |
| Ball mounting area | Max. Φ 8 inch |
| Wafer size | Max. Φ 8 inch |
| Cycle time | 120 sec. / wafer |
| Ball mounting accuracy | ± 0.05mm(3σ) |
| Dimensions | 1200(L) x 1800(W) x 1825(H) mm |
| Net weight | 2000kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp