Model SBM370
Solder ball mounting machine which enables automatic vision alignment, all-at-once flux transfer and ball mounting for mass production applications on a BGA substrate.
- High accuracy ball mounting by vision system alignment
- All-at-once substrate mounting for mass production applications
- Flexible pin transfer along the substrate warping
- Floating ball supply system with suction ball pick-up prevents ball damages
- Ball suction error detection is a standard feature
| Model | SBM370 |
|---|---|
| Solder ball size | ~ Φ 1.0mm |
| Ball mounting area | Max. 70(W)x250(L)mm |
| BGA substrate size | Max. 80(W)x270(L)mm |
| Cycle time | 13sec. / substrate |
| Ball mounting accuracy | ± 0.05mm(3σ) |
| Dimensions | 1315(L)x1180(W)x1700(H)mm |
| Net weight | 1200kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp