Model SBM500
Solder ball mounting machine which enables automatic vision alignment, all-at-once flux transfer and ball mounting for mass production applications and visual system inspection on a BGA substrate.
- High accuracy ball mounting by vision system alignment
- All-at-once substrate mounting for mass production applications
- Ball suction error detection is a standard feature
- Available for Φ 0.1mm solder balls
| Model | SBM500 |
|---|---|
| Solder ball size | Φ 0.1~0.76mm |
| Ball mounting area | Max. 270(L) x 80(W) mm |
| Substrate size | Max. 280(L) x 90(W) mm |
| Cycle time | 8 sec. / substrate |
| Ball mounting accuracy | ± 0.02mm(3σ) |
| Dimensions | 1480(L)x2400(W)x1500(H)mm |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp