Model SBP550
Solder ball mounting machine which mounts minimum 60µm solder balls on a substrate’s inner lead. Enables to mount more than several tens of thousands of balls for 60 seconds.
- Our unique ball mounting feature allows stable and high speed mounting
- System specialized for the ball mounting offers compact space saving design
- Suitable for mass production applications
| Model | SBP550 |
|---|---|
| Solder ball size | Min. Φ 0.06mm |
| Substrate size | 400(L) x 230(W) mm ~ 100(L) x 100(W) mm |
| Cycle time | Max. 80 substrates / hr. |
| Dimensions | 1300(L) x 1245(W) x 1700(H) mm |
| Net weight | 1200kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp