Model SBP661
Solder ball mounting machine for 12 inch wafer which transfers flux and mount balls on a wafer.
- Available for 12 inch wafer
- Our unique ball-drop method allows stable mounting
- Improves yields by connecting inspection and repairing systems (SBM381 type)
| Model | SBP661 |
|---|---|
| Solder ball size | Max. Φ 0.06 mm |
| Wafer size | Φ 6, Φ 8, Φ 12 inch |
| Cycle time | 30 wafers / hr (Φ 8 inch) |
| Dimensions | 3100(L) x 1300(W) x 1650(H) mm |
| Net weight | 2500kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp