Model SBP695
Solder ball mounting machine for 12 inch wafer which transfers flux and mounts balls on a wafer.
Space-saving low price semi-automatic system which manually places and removes a wafer.
- Low price
- Our unique ball mounting feature allows stable and high speed mounting
| Model | SBP695 |
|---|---|
| Solder ball size | Min. Φ 0.2 mm |
| Wafer size | Φ 6, Φ 8, Φ 12 inch |
| Cycle time | 120~240 sec. / wafer |
| Dimensions | 1200(L) x 2310(W) x 1695(H) mm |
| Net weight | 1000kg |
For further information, please contact;
SHIBUYA KOGYO CO., LTD.
International Marketing Div.
Mameda-honmachi, Kanazawa 920-8681 Japan
TEL 81-76-262-1200 FAX 81-76-223-1921
E-mail sh-info@shibuya.co.jp