Laser Ablation MachinesSLA Series Laser Ablation Machines
SLA Series
Features
- Equipped with an ultra-short pulse laser oscillator, enabling processing with minimal thermal impact on metals, resins, ceramics, etc.
- High-precision processing is achieved through a robust frame and highly reliable galvano scanner.
- High-quality cutting of multilayer materials such as flexible printed circuits (FPC) is possible.
- Carbonization-free (no burn) processing of fluoropolymer films and polyimide films.
- Fine engraving on the surface of various materials is available.
Application Examples
- Flexible printed circuit (FPC) profile cutting/depaneling
- ITO patterning
- Thin film removal
- Polymer film cutting/half-cutting
- Precision electrode cutting
- Micro-channel processing
- Ceramics cutting/engraving
Processing Samples
Flexible printed circuit (FPC) cutting
Thickness: 300 µm
Fluoropolymer film drilling
Thickness: 50 µm, hole diameter: φ50 µm
Au film stripping on glass
Thickness: 200 nm, stripping width: 30 µm
Ceramic green sheet cutting
Thickness: 100 µm, hole diameter: φ100 µm
Silicon rubber cutting
Thickness: 500 µm
Cover film (polyimide) cutting
Thickness: 12.5 µm
ITO film stripping on glass
Thickness: 200 nm, stripping width: 30 µm
Silicon carbide engraving
Engraving depth: 15 µm
Double-sided Cu-clad FR4 cutting
Thickness: 600 µm
Cu cutting
Thickness: 100 µm, hole diameter: φ50 µm
Matchstick marking
Specifications
| Model | SLA2021 |
|---|---|
| Laser oscillator | Picosecond laser Wavelength: 532 nm, Output: 20 W (40 W spec optional) / Wavelength: 355 nm, Output: 20 W |
| Max. processing range | 400 × 400 mm |
| Scan area | 34.5 × 34.5 mm (67.0 × 67.0 mm spec optional) |
| Machine dimensions ※ | 1500 (L) × 1500 (W) × 2100 (H) mm |
| Machine weight ※ | 2000 kg |
- ※
- Does not include the chiller unit or dust collector.
■Machines with a maximum processing range of 500 × 700 mm can also be manufactured.
■Specifications are subject to change due to constant improvements.
Comparison of Ablation Processing and Conventional Thermal Processing
| Item | Ablation processing | Thermal processing (Conventional laser) |
|---|---|---|
| Processing state | Instantaneous evaporation | Melting |
| Laser type | UV to IR | IR |
| Pulse width | Nanoseconds or less (with Nanosecond laser) 20 picoseconds or less (with Picosecond laser) | Tens of microseconds or more |
2-232 Wakamiya, Kanazawa, Ishikawa 920-0054 JAPAN Telephone : +81(76)263-8111 Fax : +81(76)262-2210
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