Solder Ball MountersSBP551 (For Substrates)
For micro balls (min. φ0.05mm)
SBP551 (For BGA substrates)
This system is designed for micro ball mounting on large-size substrate which ball size capability is min. 0.05mm.Metal cup design allows stable micro ball mounting without causing a ball deformation.
Features
- The metal cup method developed by Shibuya exclusively for micro ball mounting is used.
- The ball collection function drastically reduces remained balls on stencil.
- The high-accuracy vision system alignment function and the substrate thickness inspection function are combined to achieve stable ball mounting.
- Product changeover time is drastically minimized because of less tooling kits.
Metal Cup Method
This method supplies balls onto the ball mask and recovers any excess balls from the mask surface.
There is sufficient clearance between the metal cup and the ball mask, ensuring that no damage is caused to the balls or the substrate during the mounting process.
Furthermore, as a non-contact system, it eliminates factors that contribute to contamination, enabling stable and consistent ball mounting.
Specifications
| Model | SBP551 |
|---|---|
| Applicable product type | BGA micro ball substrates |
| Ball size | Min.φ0.05mm |
| Substrate size | Max. 310 (W) × 340 (L) mm |
| Stage positioning accuracy | ±0.015mm (3 σ) |
| Unit dimensions | 8050 (L) × 1850 (W) × 1915 (H) mm |
| Unit weight | 5000 kg |
Contact Us
Shibuya Corporation
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
E-mail sh-info@shibuya.co.jp
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