Solder Ball MountersSBM385 (For Substrates)
Inspection & repair machine / For micro balls (min. φ0.05mm) / Inspection & repair for balls
SBM385 (For BGA micro ball substrates)
This machine does post-ball inspection and repair (rework) for the ball mounted substrate.Machine is also capable of repairing the double ball error on the ball mounted substrate.
Inspection and repair
Features
- A ball removal mechanism enables repair of double balls and extra balls.
- A maximum of 3 million balls (min. φ0.05mm) can be inspected.
- The 2-stage structure simultaneously handles the inspection and repair processes at high throughput.
- Connecting with the micro ball mounter realizes an in-line configuration.
Specifications
| Model | SBM385 |
|---|---|
| Applicable product type | BGA、CSP、PLP、Substrate-level bumping |
| Ball size | Min.φ0.05mm |
| Inspection/repair range | Max. 250 (W) × 330 (L) mm |
| Substrate size | Max. 260 (W) × 340 (L) mm |
| Unit dimensions | 1400 (L) × 1300 (W) × 1800 (H) mm |
| Unit weight | 1200 kg |
Contact Us
Shibuya Corporation
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
E-mail sh-info@shibuya.co.jp
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