Solder Ball MountersSBP662 (For Wafers)
For micro balls (min. φ0.05mm) / High productivity & high-accuracy ball mounter
SBP662 (For wafers, micro ball mounter)
This ball mounter is for flux printing and batch-mounting of solder balls after aligning wafers with a high-accuracy vision system. Using metal cup method, balls as small as 0.05mm can be handled.
Features
- The cup method developed by Shibuya exclusively for the micro ball placement is used.
- The ball collection function drastically reduces remained balls on stencil.
- The unique ball centering mechanism achieves high-accuracy ball placement.
- The high-accuracy vision system alignment function and the wafer thickness detect function are combined to achieve stable ball placement.
- Product changeover time is drastically minimized because the wafer stage and wafer warpage correction plate can handle each wafer size.
- Remained balls on stencil are collected after the ball placement process.
Metal Cup Method
This method supplies balls onto the ball mask and recovers any excess balls from the mask surface.
There is sufficient clearance between the metal cup and the ball mask, ensuring that no damage is caused to the balls or the substrate during the mounting process.
Furthermore, as a non-contact system, it eliminates factors that contribute to contamination, enabling stable and consistent ball mounting.
Specifications
| Model | SBP662 |
|---|---|
| Applicable product type | Wafer bumping Wafer level packages Electronic components |
| Ball size | φ0.05 to 0.3 mm |
| Wafer size | φ8, φ12-inch (4 to 6-inch optionally available) |
| Capacity | 12-inch: 42 WPH (*With 1 million φ0.06 mm balls) |
| Positioning accuracy | ±0.01 mm (3σ) |
| Line dimensions | 3,350 (L) × 1,590 (W) × 1,750 (H) mm |
| Unit weight | 3,000 kg |
Contact Us
Shibuya Corporation
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
E-mail sh-info@shibuya.co.jp
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