Solder Ball MountersSBP696 (For Wafers)
For wafer level packages / Semi-automatic ball mounter / automatic vision system alignment
SBP696 (For wafers, micro ball mounter)
This micro ball mounter is for wafer bumping process, which can handle max. 12-inch wafers and substrates, performs automatic vision alignment, flux print and ball mounting.This machine is a small-footprint and semi-automatic machine.Wafer loading and unloading are done manually.
Features
- Metal cup method ensures high-quality micro ball mounting without solder ball deformation.
- The wafer stage can handle different wafer sizes to make this model most suitable for large-variety and low volume production as well as research & development.
- Remained balls on stencil are collected after the ball mounting process.
Metal Cup Method
This method supplies balls onto the ball mask and recovers any excess balls from the mask surface.
There is sufficient clearance between the metal cup and the ball mask, ensuring that no damage is caused to the balls or the substrate during the mounting process.
Furthermore, as a non-contact system, it eliminates factors that contribute to contamination, enabling stable and consistent ball mounting.
Specifications
| Model | SBP696 |
|---|---|
| Applicable product type | Wafer level packages Electronic components Substrates (BGA, CSP, etc.) |
| Ball size | φ0.05 to 0.5 mm |
| Work size | φ8, φ12-inch (φ4 to 6-inch optionally available) |
| Positioning accuracy | ±0.012 mm (3σ) |
| Unit dimensions | 2610 (L) × 1500 (W) × 1750 (H) mm |
| Unit weight | 3,000 kg |
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
Insights
Our ongoing commitment to pioneering the future of technology.
