Wire BondersFB-e18
This wire Bonder attaches ICs and LEDs to printed circuit boards.
FB-e18 Wire Bonder
Features
- Large frame handling upto 295mm × 90mm
- Comfortable operation based on a user-friendly WINDOWS® OS
- Consistent FAB formation for Au wire bonding (phi. 12 to 75µm)
Specifications
| Model | FB-e18 |
|---|---|
| Repeatability of Bonding Accuracy | ±2.5µm ( 3σ ) |
| Bonding Area | 56 mm × 80 mm |
| Bonding Time | 43 msec / wire |
| Recognition System | High-speed・High-accuracy Process Engine、1/3” CCD Camera、 ×4.0 lens |
| Unit dimensions | 780（W） × 1085（D） × 1746（H） mm |
| Unit weight | 550 kg |
■Specifications are subject to change due to constant improvements.
This product is manufactured by KAIJO Corporation
KAIJO Corporation official website
Contact Us
KAIJO Corporation
Bonder Sales Dept.
3-1-5, Sakae-cho, Hamura, Tokyo 205-8607 TEL +81(42)555-0321 FAX +81(42)579-5175
3-1-5, Sakae-cho, Hamura, Tokyo 205-8607 TEL +81(42)555-0321 FAX +81(42)579-5175
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