From bumping and assembly to inspection, we provide total support for advanced semiconductor packaging. Our ultra-high-precision die bonders, wire bonders, and solder ball mounters for micro-balls ensure precise, all-in-one automation.By integrating every process—including high-speed test handlers for 100% inspection—we optimize the entire line to directly improve production speed and yield.
We achieve high-speed, high-precision placement of solder balls essential for high-density packaging. By establishing proprietary placement technology for micro-balls, we ensure superior mounting quality for everything from warped substrates to wafers, supporting the miniaturization and thinning of next-generation devices.
In assembly processes requiring extreme positioning accuracy, such as for optical communication devices and image sensors, we achieve high-precision die bonding using our proprietary image recognition technology. From versatile machines for R&D to high-volume production systems, we solve the challenges of increasingly diverse device manufacturing.
By directly connecting chips and substrates without wires, we achieve device miniaturization and high-speed signal processing. Through the precise control of complex bonding conditions—including heat, load, and ultrasonic waves—we ensure the success of high-difficulty, next-generation assembly.
We ensure reliable wire connections between IC chips and lead frames. Our high-speed, high-precision bonding technology flexibly adapts to increasingly fine electrode pitches. By achieving stable loop and ball formation, we enhance the productivity and reliability of LED and IC packaging.
We evaluate the electrical characteristics of devices and package only non-defective units for shipment. By fully automating the process from inspection and sorting to carrier tape insertion, we ensure quality and boost productivity for LEDs and a wide range of electronic components.
We support power semiconductor production, a field growing rapidly with the shift to EVs. Our systems handle high-current, high-voltage, and high-temperature testing for everything from discretes to modules. With turret and gravity-feed options, we build optimal inspection lines tailored to any device shape.
The removal of ultrafine particles directly improves semiconductor yields. Using our proprietary ultrasonic oscillation technology, we powerfully clean contaminants from wafers and manufacturing equipment components. Even with complex shapes, we ensure uniform cleaning, contributing to high-quality production and a clean environment.
