SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS
DB258 High-Accuracy Flip Chip BonderProcess development & low volume production machine / Best seller for bonding development purposes / Accuracy: ±2µm
DB258 (Thermo-compression (TC) bonding system)
This high-accuracy thermo-compression (TC) bonder is suited for a wide variety of TC bonding development as well as low volume manufacturing.
In addition to the multi-step bonding force control and 4-step bonding temperature ramp up control, various optional functions are available to allow optimum TC development for packaging.
Laser head bonding is optionally available.
Features
- High-accuracy bonding (3 σ = ±2µm)
- The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
- The parametric sequence control enables programming control of the force, temperature and timings.
- For a wide range of bonding force from high to low.
High-accuracy force control achieved by a force feedback method. - Registration of new products is easy using the teaching method.
- A wide variety of functions are provided as standard to cope with various bonding methods.
Options
- Paste transfer
- Ultrasonic bonding unit
- Dispenser
- N2 hot purge
- Microchip (smaller than 1 mm square)
- Laser heat bonding head
- Substrate stage pulse heater, etc.
Specifications
- Model
- DB258
- Applicable product type
- Memory / Logic / Analog / Optical module / Laser diode / LED/ etc.
- Substrate size
- Max. 180 mm square
- Chip size
- 1 mm square to 20 mm square
- Chip supply method
- Tray supply
- Chip heating method
- Pulse heating
- Substrate heating method
- Constant heating
- Bonding force
- Low-force type: max. 49 N
High-force type: max. 490 N - Bonding accuracy
- ±2µm (3 σ)
- Unit dimensions
- 1000 (L) × 1100 (W) × 1845 (H) mm
- Unit weight
- 1100 kg
- INQUIRES
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SHIBUYA CORPORATION
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp