SEMICONDUCTOR / BATTERY
SYSTEMS

SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

DB258H High-Accuracy Bonder for Optical Communication and Optical Devices

Low-cost & high-accuracy bonder / Accuracy: ±2µm

DB258H (Thermo-compression (TC) bonding system)

This high-accuracy thermo-compression (TC) bonder is suitable for laser diode bonding, sub-mount bonding and optical device bonding under optical module assembly.
With parameter settings and various options which enable various bonding methods, this machine is optimal for both prototyping and low volume manufacturing.
It is also suited for module and process development.

Features
  • High-accuracy bonding (3 σ = ±2µm)
  • Capable of handling micro chips
  • The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
  • The parametric sequence control enables programming control of the force, temperature and timings.
  • The force feedback method achieves high-accuracy bonding force control.
  • A variety of optional settings, such as eutectic bonding, correspond to various bonding methods easily.
Options
  • Tool head
  • N2 hot purge
  • Ultrasonic head
  • Large-size substrate handling (7 mm or larger)
  • Dispenser
  • Paste transfer mechanism
Specifications
Model
DB258H
Applicable product type
VCSEL/LD (Laser Diode)/PD (Photo Diode)/Optical module/Analog device/LED/etc
Substrate size
0.4 mm square to 7.0 mm square
Chip size
0.25 mm square to 5.0 mm square
Chip supply method
Tray supply
Chip heating method
Pulse heating
Substrate heating method
Constant heating / pulse heating
Bonding load
0.1 to 8.8 N
Mounting accuracy
±2µm (3 σ)
Unit dimensions
1100 (W) X 1140 (D) X 2200 (H) mm
Unit weight
1300 kg
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp