SEMICONDUCTOR
FB-e18 Wire BonderThis wire Bonder attaches ICs and LEDs to printed circuit boards.
FB-e18 Wire Bonder
FB-e18
This product is manufactured by KAIJO CORPORATION
KAIJO CORPORATION official website
Features
- Large frame handling upto 295mm × 90mm
- Comfortable operation based on a user-friendly WINDOWS® OS
- Consistent FAB formation for Au wire bonding (phi. 12 to 75µm)
Specifications
- Model
- FB-e18
- Repeatability of Bonding Accuracy
- ±2.5µm ( 3σ )
- Bonding Area
- 56 mm × 80 mm
- Bonding Time
- 43 msec / wire
- Recognition System
- High-speed・High-accuracy Process Engine、1/3” CCD Camera、 ×4.0 lens
- Unit dimensions
- 780（W） × 1085（D） × 1746（H） mm
- Unit weight
- 550 kg
- ■Specifications are subject to change due to constant improvements.
- Inquiries
-
KAIJO CORPORATION
Bonder Sales Dept.
3-1-5, Sakae-cho, Hamura, Tokyo 205-8607
TEL 042-555-8889 FAX 042-579-5175