SEMICONDUCTOR / BATTERY
SYSTEMS

SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

FDB210/211 High-Accuracy Bonder for Optical Communication and Optical Devices

High-accuracy & high-throughput bonder / Wide-variety bonding / Singulated substrates / Laser diode / Accuracy: ±2µm

FDB210 / 211 (Thermo-compression (TC) bonding system)

This high-throughput and high-accuracy thermo-compression (TC) bonder is for optical module assembly such as laser diode bonding, sub-mount bonding and silicon photonics bonding.
Options are available for multiple chip bonding and other bonding methods.
FDB210 covers tray supply while FDB211 covers grip-ring supply.

Features
  • High-accuracy bonding (3 σ = ±2µm)
  • Capable of handling micro chips.
  • The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
  • The parametric sequence control enables programming control of the force, temperature and timings.
  • The force feedback method achieves high-accuracy force control.
  • A variety of optional settings, such as eutectic bonding, correspond to various bonding methods easily.
Options
  • Tool head
  • N2 purge
  • Dispenser
  • Paste transfer unit
  • Multi-chips support
  • Gel pack support
  • Ultra-low bonding force head (min. 0.1 N)
Specifications
Model
FDB210 / 211
Applicable product type
VCSEL/LD (Laser Diode)/PD (Photo Diode)/Optical module/Analog device/LED/etc
Substrate size
0.5 mm square to 10.0 mm square
Chip size
0.25 mm square to 5.0 mm square
Chip supply method
FDB211: grip ring (FDB210: tray supply)
Chip heating method
Pulse heating
Substrate heating method
Pulse heating
Bonding load
0.2 to 8.8 N
Mounting accuracy
±2µm (3 σ)
Unit dimensions
1730 (W) X 1981 (D) X 1650 (H) mm
Unit weight
3500 kg
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp