SEMICONDUCTOR / BATTERY
SYSTEMS

SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

FDB210P High-Accuracy Bonder for Optical Communication and Optical Devices

Ultra-high accuracy bonder / Accuracy: ±0.8µm

FDB210P (Thermo-compression (TC) bonding system)

This is ultra-high precision thermo-compression (TC) bonder for optical module assembly.
The high-accuracy alignment mechanism ensures ±0.8µm (3 σ).

Features
  • Ultra-high accuracy bonding (3 σ = ±0.8µm)
  • The small foot-print saves machine set-up space.
  • Capable of handling micro chips.
  • The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
  • The parametric sequence control enables programming control of the force, temperature and timings.
  • The load feedback method achieves high-accuracy load control.
  • Unique N2 purge mechanism controls oxygen concentration lower than 100ppm.
Specifications
Model
FDB210P
Applicable product type
VCSEL/LD (Laser Diode)/PD (Photo Diode)/Optical module/LIDAR/etc
Substrate size
0.4 mm square to 10.0 mm square
Chip size
0.25 mm square to 6.0 mm square
Chip supply method
Tray supply、Glip ring
Chip heating method
Pulse heating(Max.450°C)
Substrate heating method
Pulse heating(Max.450°C)
Bonding load
0.1 to 5 N
Mounting accuracy
±0.8µm (3 σ)
Unit dimensions
2000 (W) X 1400 (D) X 1700 (H) mm
Unit weight
2500 kg (machine only)
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp