SEMICONDUCTOR / BATTERY
SYSTEMS

SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

FDB250 Flip Chip Bonder / High-Accuracy Die Bonder

High-accuracy bonder / For COB, COC, SIP / Laser heater / Accuracy: ±2µm

FDB250 (Thermo-compression (TC) bonding system)

This is high-accuracy thermo-compression (TC) bonder for chip on board (CoB) packaging.
Laser heat bonding process is performed by the equipped laser heater which is to accelerate bonding process speed.
Machine allows various kind of packaging includes NCF bonding and die stacking bonding.

Features
  • Fast temperature ramp up and cooling are achieved by laser heater.
  • Temperature deformation of the heater is minimized to enable accurate gap control for bonding.
  • High-accuracy bonding (3 σ = ±2µm)
  • The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
Options
  • Tool head and various attachments
  • Exclusive air cooling mechanism
  • Pulse heater (for large-size chips: Max. 20 mm)
  • Low-force head (min. 0.2 N)
  • Mapping soft
Specifications
Model
FDB250
Applicable product type
Memory / Logic / Analog / TSV chip
Substrate size
Max.240mmX100mm
Chip size
Max. 12 mm square
Chip supply method
Max. 12inch wafer ring
Chip heating method
Laser heater
Substrate heating method
Constant heating
Bonding load
1 to 100 N
Mounting accuracy
±2µm (3σ)
Unit dimensions
1985 (W) × 2470 (D) × 1950 (H) mm (excluding substrate loader/unloader)
Unit weight
2000kg
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp