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SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

FUB281 High-Accuracy Bonder for Optical Communication and Optical Devices

High-accuracy & high-throughput bonder / Wide-variety bonding / Populated substrates / Laser diode / Accuracy of Face Up mode: ±3µm,
Face Down mode: ±2µm

FUB281 (Thermo-compression (TC) bonding system)

This high-throughput and high-accuracy thermo-compression (TC) bonder is for optical module assembly by handling aggregate substrates.
Available option enables a wide range of supply pattern and bonding methods.

Features
  • High-accuracy bonding
    Face Down mode (when the bonding plane is recognized): ±2µm (3 σ)
    Face UP mode (when the top surface pattern is recognized): ±3µm (3 σ)
    *Under high-accuracy mode
  • The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
  • The dual stage configuration achieves high productivity by executing resin transfer and chip bonding simultaneously.
  • Capable of handling micro chips.
  • Supports supply of a large variety of products.
Options
  • Tool head and various attachments
  • Dispenser mechanism
  • Resin transfer mechanism
  • UV irradiation mechanism
Specifications
Model
FUB281
Applicable product type
VCSEL/LD (Laser Diode)/PD (Photo Diode)/Optical module/Analog device/LED/etc
Substrate size
Max. 100 × 150 mm
Chip size
0.25 mm square to 5.0 mm square
Chip supply method
Grip ring / Gelpack tray
Bonding load
0.05 to 5.0 N
Mounting accuracy
±2µm (3 σ) for Face down mode
±3µm (3 σ) for Face Up mode
Unit dimensions
2840 (W) X 1940 (D) X 1700 (H) mm
Unit weight
3000 kg
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp