SEMICONDUCTOR / BATTERY
SYSTEMS

SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

FUB300 High-Accuracy Bonder for Image Sensors

Image sensor glass mounting unit / Class 100 cleanroom classification / For COW

FUB300

This is a high-accuracy bonder for chip on wafer (COW) assembly.
It is compliant with the class 100 cleanroom classification and is suited to mounting image sensor glass chips, etc.

Features
  • Max. cleanroom class 100
  • High-accuracy bonding is achieved by vision inspection and linear scale.
  • The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
Specifications
Model
FUB300
Applicable product type
CMOS image sensor / CCD
Substrate size
6-inch, 8-inch (optional: 12-inch)
Chip supply method
Tray (2-inch, 4-inch)
Exclusive tray available
Chip heating method
Max. 450℃
Substrate heating method
Max. 450℃
Bonding force
1 to 30 N
Mounting accuracy
±10µm
Unit dimensions
2300 (L) × 1900 (W) × 1910 (H) mm
Unit weight
1400 kg
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp