SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS
SBM101 Solder Ball MounterSemi-automatic solder ball mounter / Small-footprint
SBM101 (For development / Low volume production)
This is a compact and space-saving machine for automated flux transfer and ball placement on manually loaded BGA (Ball Grid Array) strip-formed substrate or flip chip BGA substrate.
This machine is most suitable for prototype and low volume manufacturing.
Features
- Since flux transfer and ball mounting are automatically done, this machine can be used widely for prototyping development and low volume production.
- The flux pin transfer method copes with largely warped BGA substrates.
- A ball flow/vacuuming method is adopted to prevent ball deformation.
- Alignment is facilitated by a vision monitoring function.
- Tooling kits can be changed without using tools for a simple changeover.
- An error detecting function using various sensors is equipped as standard.
Specifications
- Model
- SBM101
- Applicable product type
- BGA substrates (strip-formed substrates)
Flip Chip BGA substrates (singulated substrates) - Ball size
- φ0.2 to 1.0 mm
- Ball mounting range
- Max. 50 x 80 mm/mount
- Substrate size
- Max. 100 (W) x 230 (L) mm
- Tact time
- 12sec./mount
- Ball mounting
accuracy - ±0.1 mm (3 σ)
- Unit dimensions
- 1000 (L) x 810 (W) x 1700 (H) mm
- Unit weight
- 500 kg
- INQUIRES
-
SHIBUYA CORPORATION
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp