SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS
SBM280 BGA repair (rework) machineFor research and repair machine for low volume production / No attachments required
SBM280 (For development / low volume production)
This machine is for BGA rework (repair) on wafers or substrates.
Balls are reworked one by one and programmable ball array layout is possible for using this machine as experiment or R&D purpose.
Features
- The programmable single ball mount function reduces the tooling kit changeover for the individual ball array pattern.
- Identical to the high volume systems, flux transfer is done by the pin transfer method, allowing to convert its process to the high volume manufacturing.
- Machine is able to utilize as BGA rework (repair) under high volume manufacturing.
Specifications
- Model
- SBM280
- Applicable product type
- BGA substrates (strip-formed substrates)
Flip Chip BGA substrates (singulated substrates)
Wafer level packages - Ball size
- φ0.2 to 1.0 mm
- Ball mounting range
- Max. φ8 inch
- Substrate/wafer size
- Max. φ8 inch
- Tact time
- 0.8sec./ball
- Positioning accuracy
- ±0.025 mm (3 σ)
- Unit dimensions
- 1060 (L) x 800 (W) x 1680 (H) mm
- Unit weight
- 350 kg
- INQUIRES
-
SHIBUYA CORPORATION
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp