SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS
SBM371 Solder Ball MounterCompact and space-saving / High-accuracy vision system alignment / Can mount small-diameter balls (min. Φ0.15mm)
SBM371 (For BGA substrates)
After the automatic alignment by vision inspection, the solder balls as well as Coper core balls are gang-mounted on the BGA (ball grid array) strip-formed or flip chip BGA substrate at high throughput.
The compact and small-footprint design ensure high maintainability.
A fully automatic ball attach line can be configured by connecting with the optional post-ball attach inspection system (model SBI371).
Features
- High-accuracy ball mounting by vision system alignment
- Wide BGA (Ball Grid Array) substrates (width: max. 180mm) can be handled.
- A flux pin transfer method is adopted to cope with substrate warpage.
- A ball float/absorption method is introduced not to damage balls.
- Solder balls (as well as Cu core balls) are gang-mounted to the BGA (Ball Grid Array) singulated substrate (flip chip BGA) by carrier transfer.
Example of line configuration
Specifications
- Model
- SBM371
- Applicable product type
- BGA (strip-formed substrate)
Flip Chip BGA (singulated substrate) - Ball size
- φ0.15 to 0.76 mm
- Ball mounting range
- Max. 90 (W) x 290 (L) mm
- BGA substrate size
- Max. 100 (W) x 300 (L) mm
- Ball mounting
accuracy - ±0.05 mm (3 σ) (for φ0.2-mm balls)
- Unit dimensions
- 1365 (L) × 1180 (W) × 1800 (H) mm
- Unit weight
- 1200 kg
- INQUIRES
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SHIBUYA CORPORATION
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp