SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS
SBM381 wafer level inspection & repair machineInspection & repair machine / For min. φ0.05mm balls
SBM381 (For Wafers)
This machine does post-ball inspection and repair (rework) for the wafer bumping.
Machine is also capable of repairing the double ball error on the ball mounted wafer.
Features
- A ball removal mechanism enables repair of double balls and extra balls.
- A maximum of 3 million balls (min.φ0.05mm) can be inspected.
- The 2-stage structure simultaneously handles the inspection and repair processes at high throughput.
- Connecting with the micro ball mounter realizes an in-line configuration.
- Inspecting faulty locations before/after repair ensures higher mounting yield.
Specifications
- Model
- SBM381
- Applicable product type
- Wafer bumping
Wafer level packages
Electronic compornent - Ball size
- φ0.05 to φ0.5mm
- Inspection/repair range
- φ12inch
- Wafer size
- φ8, φ12 inch (φ4 to 6 inch are optionally available)
- Unit dimensions
- 1440 (L) × 1792 (W) × 1750 (H) mm
- Unit weight
- 1500 kg
- INQUIRES
-
SHIBUYA CORPORATION
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp