SEMICONDUCTOR / BATTERY
SYSTEMS

SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

SBM385 BGA (Ball Grid Array) micro ball inspection & repair (BGA rework) machine

Inspection & repair machine / For micro balls (min. φ0.05mm) / Inspection & repair for balls including double balls

SBM385 (For BGA micro ball substrates)

This machine does post-ball inspection and repair (rework) for the ball mounted substrate.
Machine is also capable of repairing the double ball error on the ball mounted substrate.

Features
  • A ball removal mechanism enables repair of double balls and extra balls.
  • A maximum of 3 million balls (min. φ0.05mm) can be inspected.
  • The 2-stage structure simultaneously handles the inspection and repair processes at high throughput.
  • Connecting with the micro ball mounter realizes an in-line configuration.
Specifications
Model
SBM385
Applicable product type
BGA、CSP、PLP、Substrate-level bumping
Ball size
Min.φ0.05mm
Inspection/repair range
Max. 250 (W) × 330 (L) mm
Substrate size
Max. 260 (W) × 340 (L) mm
Unit dimensions
1400 (L) × 1300 (W) × 1800 (H) mm
Unit weight
1200 kg
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp