SEMICONDUCTOR / BATTERY
SYSTEMS

SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

SBP550 Solder Ball Mounter

For micro balls (min. φ0.05mm)

SBP550 (For BGA substrates)

This system is designed for micro ball mounting on large-size substrate which ball size capability is min. 0.05mm.
Metal cup design allows stable micro ball mounting without causing a ball deformation.

Features
  • The metal cup method developed by Shibuya exclusively for micro ball mounting is used.
  • The ball collection function drastically reduces remained balls on stencil.
  • The high-accuracy vision system alignment function and the substrate thickness inspection function are combined to achieve stable ball mounting.
  • Product changeover time is drastically minimized because of less tooling kits.
Specifications
Model
SBP550
Applicable product type
BGA micro ball substrates
Ball size
Min.φ0.05mm
Ball mounting range
Max. 250 (W) × 330 (L) mm
Substrate size
Max. 260 (W) × 340 (L) mm
Stage positioning accuracy
±0.015mm (3 σ)
Unit dimensions
1300 (L) × 1245 (W) × 1700 (H) mm
Unit weight
1200 kg
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp