SEMICONDUCTOR / BATTERY
SYSTEMS

SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

SBP551 Solder Ball Mounter

For micro balls (min. φ0.05mm)

SBP551 (For BGA substrates)

This system is designed for micro ball mounting on large-size substrate which ball size capability is min. 0.05mm.
Metal cup design allows stable micro ball mounting without causing a ball deformation.

Features
  • The metal cup method developed by Shibuya exclusively for micro ball mounting is used.
  • The ball collection function drastically reduces remained balls on stencil.
  • The high-accuracy vision system alignment function and the substrate thickness inspection function are combined to achieve stable ball mounting.
  • Product changeover time is drastically minimized because of less tooling kits.
Specifications
Model
SBP551
Applicable product type
BGA micro ball substrates
Ball size
Min.φ0.05mm
Substrate size
Max. 310 (W) × 340 (L) mm
Stage positioning accuracy
±0.015mm (3 σ)
Unit dimensions
8050 (L) × 1850 (W) × 1915 (H) mm
Unit weight
5000 kg
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp