SEMICONDUCTOR / BATTERY
SYSTEMS

SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS

SBP662 Solder Ball Mounter

For micro balls (min. φ0.05mm) / High productivity & high-accuracy ball mounter

SBP662 (For wafers, micro ball mounter)

This ball mounter is for flux printing and batch-mounting of solder balls after aligning wafers with a high-accuracy vision system.
Using metal cup method, balls as small as 0.05mm can be handled.

Features
  • The cup method developed by Shibuya exclusively for the micro ball placement is used.
  • The ball collection function drastically reduces remained balls on stencil.
  • The unique ball centering mechanism achieves high-accuracy ball placement.
  • The high-accuracy vision system alignment function and the wafer thickness detect function are combined to achieve stable ball placement.
  • Product changeover time is drastically minimized because the wafer stage and wafer warpage correction plate can handle each wafer size.
  • Remained balls on stencil are collected after the ball placement process.
Specifications
Model
SBP662
Applicable product type
Wafer bumping
Wafer level packages
Electronic compornent
Ball size
φ0.05 to 0.3mm
Wafer size
φ8、φ12-inch (4 to 6-inch are optionally available)
Capacity
12-inch: 42 WPH * With 1 million φ0.06mm balls
Positioning accuracy
±0.01mm(3σ)
Line dimensions
3350 (L) × 1590 (W) × 1750 (H) mm
Unit weight
3000 kg
INQUIRES

SHIBUYA CORPORATION

Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp