SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS
SBP696 Solder ball mounterFor wafer level packages / Semi-automatic ball mounter / automatic vision system alignment
SBP696 (For wafers, micro ball mounter)
This micro ball mounter is for wafer bumping process, which can handle max. 12-inch wafers and substrates, performs automatic vision alignment, flux print and ball mounting.
This machine is a small-footprint and semi-automatic machine.
Wafer loading and unloading are done manually.
Features
- Metal cup method ensures high-quality micro ball mounting without solder ball deformation.
- The wafer stage can handle different wafer sizes to make this model most suitable for large-variety and low volume production as well as research & development.
- Remained balls on stencil are collected after the ball mounting process.
Specifications
- Model
- SBP696
- Applicable product type
- Wafer level packages
Electronic compornent
Substrate(BGA,CSP etc.) - Ball size
- φ0.05 to 0.5mm
- Work size
- φ8, φ12-inch(φ4 to 6 inch are optionally available)
- Positioning accuracy
- ±0.012m (3 σ)
- Unit dimensions
- 2610 (L) × 1500 (W) × 1750 (H) mm
- Unit weight
- 3000 kg
- INQUIRES
-
SHIBUYA CORPORATION
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp