SEMICONDUCTOR / BATTERY MANUFACTURING SYSTEMS
SDM200C High-Accuracy Bonder for Image SensorsImage sensor glass mounting line / Class 100 cleanroom classification
SDM200C
This is a fully automatic integrated line starting from chip mounting on image sensor packages, wire bonding, cover glass mounting, through to tray storage.
It is composed of a resin application unit, glass mounting unit, inspection unit, curing oven and storage unit.
Features
- Max. cleanroom class 100
- Integrated line for CCD/COMS image sensor assembly
- Speedy resin application with a dual-head system.
- Vision inspection function provided for resin application status.
Specifications
- Model
- SDM200C
- Applicable product type
- CMOS image sensor / CCD
- Package size
- Max. 14.5 mm, thickness of 1.0 mm
- Package supply method
- Exclusive carrier: Max. 220 × 26 mm, thickness of 1.1 mm
- Chip size
- 3 to 8 mm, thickness of 0.2 to 0.65 mm
- Chip supply method
- 8-inch wafer ring
- Glass size
- 3 to 14 mm, thickness of min. 0.3 mm
- Glass supply method
- Dedicated tray
- Storage of complete products
- JEDEC tray, etc.
- Glass
bonding method - UV bonding
- Bonding force
- Chip: 0.5 to 5.0 N
Glass: 0.5 to 2.0 N - Mounting accuracy
- Chip: ±20µm (3 σ)、Glass: ±10µm (3 σ)
- ライン寸法
- 8710 mm × 1400 mm × 1800 mm
- Line weight
- 7450 kg (excluding wire bonder)
- INQUIRES
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SHIBUYA CORPORATION
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054
TEL +81(76)262-2201 FAX +81(76)262-2210
E-mail sh-info@shibuya.co.jp