Flip Chip Bonders
DB258
Process development & low volume production machine / Best seller for bonding development purposes / Accuracy: ±2µm
DB258 (Thermo-compression (TC) bonding system)
This high-accuracy thermo-compression (TC) bonder is suited for a wide variety of TC bonding development as well as low volume manufacturing. In addition to the multi-step bonding force control and 4-step bonding temperature ramp up control, various optional functions are available to allow optimum TC development for packaging. Laser head bonding is optionally available.
Features
- High-accuracy bonding (3 σ = ±2µm)
- The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
- The parametric sequence control enables programming control of the force, temperature and timings.
- For a wide range of bonding force from high to low.
High-accuracy force control achieved by a force feedback method. - Registration of new products is easy using the teaching method.
- A wide variety of functions are provided as standard to cope with various bonding methods.
Calibration
The calibration mechanism stabilizes alignment accuracy by detecting the relative positional deviation of the camera used for vision system alignment and feeding back the deviation when alignment for mounting is performed.
With vision system alignment, position accuracy cannot be maintained if the camera position changes because this results in changes in mounting positions as well. The camera is fixed in place and may not seem to be moving, but factors such as use of heating mechanisms and changes in ambient temperature cause the machine to expand/contract, resulting in changes in the camera position over time.
The calibration mechanism therefore offsets such positional changes that occur over time to stabilize alignment accuracy.
This mechanism first performs pattern matching using both the top camera and bottom camera with respect to the same target mark to detect each camera’s deviation from the target mark. By feeding back this deviation when alignment for mounting is performed, the deviation of the camera position is offset.
Options
- Paste transfer
- Ultrasonic bonding unit
- Dispenser
- N2 hot purge
- Microchip (smaller than 1 mm square)
- Laser heat bonding head
- Substrate stage pulse heater, etc.
Specifications
| Model | DB258 |
|---|---|
| Applicable product type | Memory / Logic / Analog / Optical module / Laser diode / LED/ etc. |
| Substrate size | Max. 180 mm square |
| Chip size | 1 mm square to 20 mm square |
| Chip supply method | Tray supply |
| Chip heating method | Pulse heating |
| Substrate heating method | Constant heating |
| Bonding force | Low-force type: max. 49 N High-force type: max. 490 N |
| Bonding accuracy | ±2µm (3 σ) |
| Unit dimensions | 1000 (L) × 1100 (W) × 1845 (H) mm |
| Unit weight | 1100 kg |
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
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