Solder Ball Mounters
SBM371 (For Substrates)
Compact and space-saving / High-accuracy vision system alignment / Can mount small-diameter balls (min. φ0.15mm)
SBM371 (For Substrates)
After the automatic alignment by vision inspection, the solder balls as well as Coper core balls are gang-mounted on the BGA (ball grid array) strip-formed or flip chip BGA substrate at high throughput.The compact and small-footprint design ensure high maintainability.A fully automatic ball attach line can be configured by connecting with the optional post-ball attach inspection system (model SBI371).
Features
- High-accuracy ball mounting by vision system alignment
- Wide BGA (Ball Grid Array) substrates (width: max. 180mm) can be handled.
- A flux pin transfer method is adopted to cope with substrate warpage.
- A ball float/absorption method is introduced not to damage balls.
- Solder balls (as well as Cu core balls) are gang-mounted to the BGA (Ball Grid Array) singulated substrate (flip chip BGA) by carrier transfer.
Pin transfer
Flux transfer is done by the pin transfer method.
All pins are suspended individually using a cushion so that flux application and ball mounting are done stably even when a substrate is warped.
Before flux transfer to the pins, a squeegee levels the flux surface.
Example of line configuration
Specifications
| Model | SBM371 |
|---|---|
| Applicable product type | BGA (strip-formed substrate) Flip Chip BGA (singulated substrate) |
| Ball size | φ0.15 to 0.76 mm |
| Ball mounting range | Max. 90 (W) x 290 (L) mm |
| BGA substrate size | Max. 100 (W) x 300 (L) mm |
| Ball mounting accuracy |
±0.05 mm (3 σ) (for φ0.2-mm balls) |
| Unit dimensions | 1365 (L) × 1180 (W) × 1800 (H) mm |
| Unit weight | 1200 kg |
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
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