High-Accuracy Die Bonders

FDB210/211

This high-throughput and high-accuracy thermo-compression (TC) bonder is for optical module assembly such as laser diode bonding, sub-mount bonding and silicon photonics bonding. Options are available for multiple chip bonding and other bonding methods. FDB210 covers tray supply while FDB211 covers grip-ring supply.

The calibration mechanism stabilizes alignment accuracy by detecting the relative positional deviation of the camera used for vision system alignment and feeding back the deviation when alignment for mounting is performed.
With vision system alignment, position accuracy cannot be maintained if the camera position changes because this results in changes in mounting positions as well. The camera is fixed in place and may not seem to be moving, but factors such as use of heating mechanisms and changes in ambient temperature cause the machine to expand/contract, resulting in changes in the camera position over time.
The calibration mechanism therefore offsets such positional changes that occur over time to stabilize alignment accuracy.
This mechanism first performs pattern matching using both the top camera and bottom camera with respect to the same target mark to detect each camera’s deviation from the target mark. By feeding back this deviation when alignment for mounting is performed, the deviation of the camera position is offset.