High-Accuracy Die Bonders
FDB350
High-accuracy bonder / For COW / Laser heater / Accuracy: ±2µm
FDB350 (Thermo-compression (TC) bonding system)
This is high-accuracy thermo-compression (TC) bonder for chip on wafer (CoW) packaging. Laser heat bonding process is performed by the equipped laser heater which is to accelerate bonding process speed. Machine allows various kind of packaging includes NCF bonding and die stacking bonding.
Features
- Fast temperature ramp up and cooling are achieved by laser heater.
- Temperature deformation of the heater is minimized to enable accurate gap control for bonding.
- High-accuracy bonding (3 σ = ±2µm)
- The automatic calibration mechanism stabilizes accuracy by canceling positional changes which occur with time.
Laser Heater
This system performs heating by irradiating the target object with laser light through glass.
Two methods are available: the "Indirect Method," which heats via a tool material, and the "Direct Method," which irradiates the chip or other components directly.
Compared to conventional pulse heaters, this technology enables faster temperature ramp-up and rapid cooling. Furthermore, since there is minimal thermal expansion of the head, height control can be managed with ease.
The laser is composed of multiple fibers, allowing for selective irradiation of specific areas. This makes it possible to partially heat targeted sections within a single chip.
Calibration
The calibration mechanism stabilizes alignment accuracy by detecting the relative positional deviation of the camera used for vision system alignment and feeding back the deviation when alignment for mounting is performed.
With vision system alignment, position accuracy cannot be maintained if the camera position changes because this results in changes in mounting positions as well. The camera is fixed in place and may not seem to be moving, but factors such as use of heating mechanisms and changes in ambient temperature cause the machine to expand/contract, resulting in changes in the camera position over time.
The calibration mechanism therefore offsets such positional changes that occur over time to stabilize alignment accuracy.
This mechanism first performs pattern matching using both the top camera and bottom camera with respect to the same target mark to detect each camera’s deviation from the target mark. By feeding back this deviation when alignment for mounting is performed, the deviation of the camera position is offset.
Options
- Tool head and various attachments
- Exclusive air cooling mechanism
- Pulse heater (for large-size chips: Max. 20 mm)
- Low-force head (min. 0.2 N)
- Mapping soft
Specifications
| Model | FDB350 |
|---|---|
| Applicable product type | Memory / Logic / Analog / TSV chip |
| Substrate size | Max. 12inch wafer |
| Chip size | Max. 12 mm square |
| Chip supply method | Max. 12inch wafer ring |
| Chip heating method | Laser heater |
| Substrate heating method | Constant heating |
| Bonding load | 1 to 100 N |
| Mounting accuracy | ±2µm (3 σ) |
| Unit dimensions | 2690 (W) × 1990 (D) × 2000 (H) mm (excluding substrate wafer supply unit) |
| Unit weight | 2200 kg |
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
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