High-Accuracy Die Bonders

FDB250

This is high-accuracy thermo-compression (TC) bonder for chip on board (CoB) packaging. Laser heat bonding process is performed by the equipped laser heater which is to accelerate bonding process speed. Machine allows various kind of packaging includes NCF bonding and die stacking bonding.

The calibration mechanism stabilizes alignment accuracy by detecting the relative positional deviation of the camera used for vision system alignment and feeding back the deviation when alignment for mounting is performed.
With vision system alignment, position accuracy cannot be maintained if the camera position changes because this results in changes in mounting positions as well. The camera is fixed in place and may not seem to be moving, but factors such as use of heating mechanisms and changes in ambient temperature cause the machine to expand/contract, resulting in changes in the camera position over time.
The calibration mechanism therefore offsets such positional changes that occur over time to stabilize alignment accuracy.
This mechanism first performs pattern matching using both the top camera and bottom camera with respect to the same target mark to detect each camera’s deviation from the target mark. By feeding back this deviation when alignment for mounting is performed, the deviation of the camera position is offset.