Solder Ball Mounters
SBM381 (For Wafers)
Inspection & repair machine / For min. φ0.05mm balls
SBM381 (For Wafers)
This machine does post-ball inspection and repair (rework) for the wafer bumping. Machine is also capable of repairing the double ball error on the ball mounted wafer.
Inspection and repair
Features
- A ball removal mechanism enables repair of double balls and extra balls.
- A maximum of 3 million balls (min.φ0.05mm) can be inspected.
- The 2-stage structure simultaneously handles the inspection and repair processes at high throughput.
- Connecting with the micro ball mounter realizes an in-line configuration.
- Inspecting faulty locations before/after repair ensures higher mounting yield.
Specifications
| Model | SBM381 |
|---|---|
| Applicable product type | Wafer bumping Wafer level packages Electronic components |
| Ball size | φ0.05 to φ0.5 mm |
| Inspection/repair range | φ12-inch |
| Wafer size | φ8, φ12-inch (φ4 to 6-inch optionally available) |
| Unit dimensions | 1440 (L) × 1792 (W) × 1750 (H) mm |
| Unit weight | 1,500 kg |
Contact Us
Shibuya Corporation
Mechatronics Div. S&H Div. Semi-Conductor System Sales Dept.
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
2-232, Wakamiya, Kanazawa 920-0054 JAPAN Telephone : +81(76)262-2201 Fax : +81(76)262-2210
E-mail sh-info@shibuya.co.jp
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